Huarui segondè tanperati nikèl ki baze sou alyaj IN625 poud se yon poud optimisé, espesyalman apwopriye pou SLM fòme teknoloji, ki gen ladan EOS Selective Lazè k ap fonn Ekipman (EOSINT M Seri), Konsèp Lazè Ekipman k ap fonn, Renishaw Lazè Ekipman k ap fonn, Ameriken 3D Sistèm Lazè Ekipman k ap fonn, ak enstiti rechèch domestik ak enstiti.
Atravè distribisyon an diferan gwosè patikil, li kapab tou divize an poud bòdi piki, poud CLADDING lazè, poud flite, poud cho izostatik peze ak sou sa.
Konpozisyon chimik (%) nan Inconel 625 Powder | ||||||
Cr | Co | Al | Mo | Mn | Ti | Nb |
20-23 | ≤1.0 | ≤0.4 | 8.0-10 | ≤0.5 | ≤0.4 | 3.15-4.15 |
Fe | C | Si | P | S | O | Ni |
≤0.5 | ≤0.1 | ≤0.5 | ≤0.015 | ≤0.15 | ≤0.02 | Bal |
Dansite aparan: 4.50g/cm3 | Koulè: gri | Fòm: esferik | ||||
Gwosè patikil | 15-53mikron;45-105mikron;45-150 mikron |
Pwopriyete poud Inconel 625 | ||||||
Gwosè Range | 0 ~ 25um | 0 ~ 45um | 15 ~ 45um | 45 ~ 105um | 75 ~ 180um | |
Mòfoloji | Esferik | Esferik | Esferik | Esferik | Esferik | |
Distribisyon gwosè patikil | D10: 6um | D10: 9um | D10: 14um | D10: 53um | D10: 78um | |
D50:16um | D50: 28um | D50: 35um | D50: 69um | D50: 120um | ||
D90: 23um | D90: 39um | D90: 45um | D90: 95um | D90: 165um | ||
Kapasite koule | N/A | ≤30S | ≤28S | ≤16S | ≤18S | |
Dansite aparan | 4.2g/cm3 | 4.5g/cm3 | 4.4g/cm3 | 4.5g/cm3 | 4.4g/cm3 | |
Kontni oksijèn (% wt) | O: 0.06 ~ 0.018wt%, ASTM estanda: ≤0.02 wt% | |||||
3D enprime gaz atomize Inconel 625 Powder ak pi bon pri | ||||||
(ba oksijèn, segondè sphericity ak bon likidite) |
1. HVOF
2. Plasma kouch
3. 3D enprime / aditif manifakti
4. poud soudi
5. metal piki par
6. cho izostatik
Nou menm tou nou bay Inconel 718 poud, NiCr poud, NiAl poud, Ni20-Ni65 poud, Byenveni nan ankèt!